Originally Posted by e3NiNe

There's a metric shit ton of issues with the non-Jasper 360's.

1. The thermal paste applied should be a thin layer over the GPU & CPU. When I stripped my system, I found an entire tube of unknown rubbery goop on both chips. That much applied will actually cook the processors.

2. The V1 (launch till early 2008) heatsinks were bad. Since then, they've doubled in size.

3. The "X Clamp" holding the heatsink(s) to the motherboard apply too much pressure. The solder holding the GPU to the motherboard breaks along the edges after time.

4. The design of the fan shroud only allows air to be drawn from the CPU, not the GPU.

5. The standoffs (mobo mounting spot) are uneven at the center of the board. This causes warping.

Combine all of this with 90nm or 65nm processor heat and you have RRoD ... over and over and over. When I took apart my Elite (90nm CPU, 90nm GPU), the motherboard wouldn't lay flat. It looked like a potato chip.


Send the 360 back for repair, but consider grabbing an Arcade system from Amazon. I believe they're $159 shipped.